Origin Of News Release: Munich, Germany
Original Release Date: September 25, 2008
Announcement: Qimonda DDR3 Modules Validated On Intel Core i7 And X58 Chipset
Availability: Not specified but probably Q4 2008 or Q1 2009
September 27, 2008
Intel's Core i7 processor line is the latest offering of low-power consumption processors. Respectively called UDIMMs (Unregistered Dual In-Line Memory Module), the Qimonda chips will more than likely be re-badged by several memory sellers. This is something to think about when buying your favorite memory chips. Generally, you can find out who the original chipmaker is by contacting the company who is selling the chips and/or viewing/posting messages on the company's online forum.
Qimonda AG, a leading manufacturer of memory products, announced validation of its 1 GB and 2 GB DDR3 Unbuffered Dual In-Line Memory Modules (UDIMMs) on the upcoming Intel Core i7 processor and Intel X58 Express chipset, bringing the exceptional thermal efficiency and performance of Qimonda memory to this next generation high-end desktop platform.
Validation of the DDR3 1067 non-ECC UDIMMs for the new Intel Core i7 platform being released later this year reinforces Qimondas leadership role in the industry transition to a memory standard that provides up to 30% improvement in power usage while offering up to twice the data rate of DDR2 memories. Qimonda DDR3 components were initially released more than one year ago, and Qimonda DDR3 modules have now been validated on multiple Intel platforms.
With an integrated controller supporting up to three memory modules per channel, the Intel Core i7 microarchitecture fully leverages the performance of DDR3 memory to deliver exceptional memory bandwidth while reducing memory latency. DDR3 is also the first memory designed for operation at 1.5V, making it an ideal match to the power efficient Intel processor and chipset architectures.
Weve worked closely with Intel to validate DDR3 modules for application in Core architecture systems across the full range of supported platforms, said Michael Buckermann, Vice President of Business Unit Computing, Qimonda AG. We are very pleased to be able to offer these solutions as part of the industrys broadest portfolio of DDR3 DIMMs from 800 to 1866 speed grades.
Qimonda has been a valued partner in enabling Core microarchitecture platforms and participating in our program for evaluation of memory energy efficiency and performance, said Paul Fahey, Director of Platform Memory Operations, Intel Corporation. The company has consistently met the requirements for power use and thermal performance across all platforms, and weve selected Qimonda DIMMs for several channel partner and media evaluation programs in our platform roll-outs this year.
Qimonda AG (NYSE:QI) is a leading global memory supplier with a broad diversified DRAM product portfolio. The company generated net sales of Euro 3.61 billion in financial year 2007 and had approximately 13,500 employees worldwide. Qimonda has access to four 300mm manufacturing sites on three continents and operates six major R&D facilities. The company provides DRAM products for a wide variety of applications, including in the computing, infrastructure, graphics, mobile and consumer areas, using its power saving technologies and designs. Further information is available at www.qimonda.com.
This press release contains forward-looking statements based on assumptions and forecasts made by Qimonda management and third parties. Statements that are not historical facts, including statements about our beliefs and expectations, are forward-looking statements. These statements are based on current plans, estimates and projections, and speak only as of the date they are made. We undertake no obligation to update any of them in light of new information or future events.
These forward-looking statements involve inherent risks and are subject to a number of uncertainties, including trends in demand and prices for semiconductors generally and for our products in particular, the success of our development efforts, both alone and with our partners, the success of our efforts to introduce new production processes at our facilities and the actions of our competitors, the availability of funds for planned expansion efforts and the outcome of antitrust investigations and litigation matters, as well as other factors.
We caution you that these and a number of other known and unknown risks, uncertainties and other factors could cause actual future results, or outcomes to differ materially from those expressed in any forward-looking statement. These factors include those identified under the heading "Risk Factors" in our most recent Annual Report on Form 20-F and our prospectus supplement filed with the SEC on February 11, 2008, each of which is available without charge on our website and at www.sec.gov.